DDR 400
 

Feature
Capacity:

  Feature
* VDD : 2.3V ~ 2.7V, VDDQ : 2.3V ~ 2.7V for DDR266/333.
* VDD : 2.5V ~ 2.7V, VDDQ : 2.5V ~ 2.7V for DDR400.
* Double-data-rate architecture; two data transfers per clock cycle.
* Bidirectional data strobe [DQ] (x4,x8) & [L(U)DQS] (x16).
* Differential clock inputs(CK and /CK).
* DLL aligns DQ and DQS transition with CK transition.
* Programmable Read latency 2, 2.5 (clock) for DDR266/333.
* Programmable Read latency 2.5,3 (clock) for DDR400.
* Programmable Burst length (2, 4, 8).
* Programmable Burst type (sequential & interleave).
* Edge aligned data output, center aligned data input.
* Auto & Self refresh, 7.8 us refresh interval(8K/64ms refresh).
* Serial presence detect with EEPROM.
* PCB : Height 1,250 (mil) & single (256, 512MB), double (1GB) sided.
* SSTL_2 Interface.

 


¡@Capacity:

Density (Mbytes) Organization Speed Component Composition
64 8M * 64 PC2100 / 2700 / 3200 8M * 8 * 8ea
64 8M * 64 PC2100 / 2700 / 3200 8M * 16 * 4ea
128 16M * 64 PC2100 / 2700 / 3200 8M * 8 * 16ea
128 64M * 64 PC4200 / 5300 32M * 16 * 8ea
128 16M * 64 PC2100 / 2700 / 3200 16M * 8 * 8ea
128 16M * 64 PC2100 / 2700 / 3200 16M * 16 * 4ea
256 32M * 64 PC2100 / 2700 / 3200 16M * 8 * 16ea
256 32M * 64 PC2100 / 2700 / 3200 16M * 16 * 8ea
256 32M * 64 PC2100 / 2700 / 3200 32M * 8 * 8ea
256 32M * 64 PC2100 / 2700 / 3200 32M * 16 * 4ea
512 64M * 64 PC2100 / 2700 / 3200 32M * 8 * 16ea
512 64M * 64 PC2100 / 2700 / 3200 32M *16 * 8ea
512 64M * 64 PC2100 / 2700 / 3200 64M * 8 * 8ea
1024 128M * 64 PC2100 / 2700 / 3200 64M * 8 * 16ea